Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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14039433
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Filing Dt:
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09/27/2013
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Publication #:
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Pub Dt:
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01/23/2014
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Inventors:
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Christopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Title:
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Polymer Composition for Microelectronic Assembly
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9921 BRECKSVILLE ROAD |
| BRECKSVILLE, OHIO 44141 |
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| PROMERUS, LLC |
| 9921 BRECKSVILLE ROAD |
| BRECKSVILLE, OH 44141 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8 HIGASHI-SHINAGAWA 2-CHOME |
| TENNOZ PARKSIDE BUILDING |
| SHINAGAWA-KU, TOKYO, JAPAN 140-0002 |
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| PROMERUS, LLC |
| 9921 BRECKSVILLE ROAD |
| BRECKSVILLE, OH 44141 |
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