Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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13235176
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Filing Dt:
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09/16/2011
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Publication #:
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Pub Dt:
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12/20/2012
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Inventors:
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Kwang Soo Kim, Ji Hyun Park, Seog Moon Choi, Young Ki Lee
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Title:
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POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN 3-DONG YEONGTONG-GU |
| SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| LADAS & PARRY |
| 5670 WILSHIRE BOULEVARD, SUITE 2100 |
| LOS ANGELES, CA 90036-5679 |
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