Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/10/2014
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Application #:
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12037958
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Filing Dt:
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02/27/2008
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Publication #:
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Pub Dt:
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08/28/2008
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Inventors:
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Yoshikazu OSHIKA, Munenori HASHIMOTO, Masayuki NAKANO
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Title:
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SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD FOR MANUFACTURING SUCH A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, |
TOKYO, JAPAN 101-0021 |
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MASAO YOSHIMURA, CHEN YOSHIMURA LLP |
1101 PENNSYLVANIA AVE., NW |
6TH FLOOR |
WASHINGTON, DC 20004 |
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