Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/10/2014
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Application #:
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13665976
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Filing Dt:
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11/01/2012
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Publication #:
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Pub Dt:
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07/25/2013
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Inventors:
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Hanyi Ding, Alvin J. Joseph, Anthony K. Stamper
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Title:
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THROUGH WAFER VIAS AND METHOD OF MAKING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| SCHMEISER, OLSEN & WATTS |
| 22 CENTURY HILL DRIVE, SUITE 302 |
| LATHAM, NY 12110 |
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