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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8748885
Issue Dt:
06/10/2014
Application #:
13371198
Filing Dt:
02/10/2012
Publication #:
20130207098
Pub Dt:
08/15/2013
Inventors:
Chung-Yi HUANG, Hui-Mei JAO, Shiu-Ko JiangJian, Tung-Ti YEH, Ya Wen WU, Ting-Chun WANG et al
Title:
SOFT MATERIAL WAFER BONDING AND METHOD OF BONDING
Assignment: 1
Reel/Frame:
028113/0771Recorded: 04/26/2012Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YEH, TUNG-TI
Exec Dt:
02/21/2012
HUANG, CHUNG-YI
Exec Dt:
03/28/2012
WU, YA WEN
Exec Dt:
02/21/2012
JAO, HUI-MEI
Exec Dt:
02/21/2012
WANG, TING-CHUN
Exec Dt:
02/29/2012
JANGJIAN, SHIU-KO
Exec Dt:
02/22/2012
CHUNG, CHIA-HUNG
Exec Dt:
02/22/2012
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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