Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/17/2014
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Application #:
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13820627
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Filing Dt:
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03/04/2013
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Publication #:
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Pub Dt:
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06/20/2013
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Inventors:
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Takashi Kawana, Naoya Kanamori, Ryuichi Murayama
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Title:
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RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PRODUCED USING RESIN COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P. O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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