Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/17/2014
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Application #:
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12485428
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Filing Dt:
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06/16/2009
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Inventor:
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Chender Chen
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Title:
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Lead Frame Apparatus and Method for Improved Wire Bonding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 FL., NO. 1, ALLEY 20, LANE 407, SEC. 2, TI-DING BLVD., NEI-HU DISTRICT |
| TAIPEI, TAIWAN |
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| HORACE NG |
| 5488 MARVELL LANE |
| SANTA CLARA, CA 95054 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ARGYLE HOUSE, 41A CEDAR AVENUE |
| HAMILTON, BERMUDA HM12 |
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| HORACE NG |
| 5488 MARVELL LANE |
| SANTA CLARA, CA 95054 |
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