skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 2
Patent #:
8754524
Issue Dt:
06/17/2014
Application #:
13397876
Filing Dt:
02/16/2012
Publication #:
20120146219
Pub Dt:
06/14/2012
Inventors:
Anthony Curtis, Guy F. Burgess, Michael Johnson, Ted Tessier, Yuan Lu
Title:
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
Assignment: 1
Reel/Frame:
027715/0853Recorded: 02/16/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CURTIS, ANTHONY
Exec Dt:
02/14/2007
BURGESS, GUY F.
Exec Dt:
02/14/2007
JOHNSON, MICHAEL
Exec Dt:
02/14/2007
TESSIER, TED
Exec Dt:
02/15/2007
LU, YUAN
Exec Dt:
03/05/2007
Assignee:
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE
PHOENIX, ARIZONA 85034
Correspondent:
GREENBERG TRAURIG, LLP (PHX) C/O GREENBE
77 WEST WACKER DRIVE, SUITE 3100
CHICAGO, IL 60601
Assignment: 2
Reel/Frame:
055213/0924Recorded: 02/04/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
FLIPCHIP INTERNATIONAL, LLC
Exec Dt:
01/11/2021
Assignee:
HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE
KUNSHAN, JIANGSU, CHINA 215300
Correspondent:
GANG YU
ACIP INTERNATIONAL, INC. 419 10TH ST,
SF, CA 94103

Search Results as of: 04/28/2024 11:34 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT