Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/24/2014
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Application #:
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13800663
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Filing Dt:
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03/13/2013
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Publication #:
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Pub Dt:
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08/01/2013
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Inventor:
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Shiang-Bau Wang
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Title:
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END-TO-END GAP FILL USING DIELECTRIC FILM
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 324 |
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HAYNES AND BOONE, LLP IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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