Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/01/2014
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Application #:
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13706488
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Filing Dt:
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12/06/2012
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Publication #:
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Pub Dt:
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12/26/2013
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Inventors:
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Paul A. Kohl, Rajarshi Saha, Nathan Fritz
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Title:
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Packaging Compatible Wafer Level Capping of MEMS Devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 505 TENTH STREET, NW |
| ATLANTA, GEORGIA 30332-0415 |
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| PROMERUS LLC |
| 9921 BRECKSVILLE ROAD |
| BRECKSVILLE, OH 44141 |
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