Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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14132192
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Filing Dt:
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12/18/2013
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Publication #:
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Pub Dt:
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04/17/2014
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Inventors:
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Hsien-Wei CHEN, Shih-Hsun HSU
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Title:
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SEMICONDUCTOR WAFER WITH ASSISTING DICING STRUCTURE AND DICING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 400 INTERSTATE NORTH PARKWAY SE |
| SUITE 200 |
| ATLANTA, GA 30339 |
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