Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/08/2014
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Application #:
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13325423
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Filing Dt:
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12/14/2011
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Publication #:
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Pub Dt:
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06/21/2012
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Inventors:
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Koji Noda, Satoshi Sakimichi, Kimio Kohara, Masahiro Sakamoto
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Title:
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BONDING STRUCTURE AND BONDING METHOD OF HEAT DIFFUSION MEMBER, AND COOLING UNIT USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| 14, IWAYA, SHIMOHASUMI-CHO |
| NISHIO-CITY, AICHI-PREF., JAPAN 445-0012 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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