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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/15/2014
Application #:
13187760
Filing Dt:
07/21/2011
Publication #:
Pub Dt:
04/05/2012
Inventors:
Ju-il Choi, Kyu-Ha Lee, Jae-Hyun Phee, Jung-Hwan Kim, Tae Hong Min
Title:
METHODS OF FORMING A SEMICONDUCTOR PACKAGE USING A SEED LAYER AND SEMICONDUCTOR PACKAGES FORMED USING THE SAME
Assignment: 1
Reel/Frame:
026628/0210Recorded: 07/21/2011Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/21/2011
Exec Dt:
06/21/2011
Exec Dt:
06/21/2011
Exec Dt:
06/21/2011
Exec Dt:
06/21/2011
Assignee:
416 MAETAN-DONG, YEONGTONGPGU, SUWON-SI
GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
MYERS BIGEL SIBLEY & SAJOVEC
PO BOX 37428
RALEIGH, NC 27627

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