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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/22/2014
Application #:
13092866
Filing Dt:
04/22/2011
Publication #:
Pub Dt:
04/12/2012
Inventor:
Meng-Jen Wang
Title:
SEMICONDUCTOR ELEMENT HAVING CONDUCTIVE VIAS AND SEMICONDUCTOR PACKAGE HAVING A SEMICONDUCTOR ELEMENT WITH CONDUCTIVE VIAS AND METHOD FOR MAKING THE SAME
Assignment: 1
Reel/Frame:
026177/0718Recorded: 04/25/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/21/2011
Assignee:
NO. 26, CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Correspondent:
GEORGE D. MORGAN
4635 S LAKESHORE DR.
TEMPE, AZ 85282

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