Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/22/2014
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Application #:
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12755515
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Filing Dt:
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04/07/2010
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Publication #:
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Pub Dt:
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10/14/2010
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Inventors:
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Kenta Uchiyama, Akihiko Tateiwa
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Title:
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STACKED CHIPS PACKAGE HAVING FEED-THROUGH ELECTRODE CONNECTING THE FIRST AND SECOND SEMICONDUCTOR COMPONENTS VIA AN ADHESIVE LAYER.
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI, NAGANO-SHI, |
| NAGANO, JAPAN 381-2287 |
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| IPUSA, P.L.L.C |
| 1054 31ST STREET, N.W. |
| SUITE 400 |
| WASHINGTON, DC 20007 |
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