Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/22/2014
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Application #:
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13124751
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Filing Dt:
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04/18/2011
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Publication #:
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Pub Dt:
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09/01/2011
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Inventor:
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Akira Oikawa
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Title:
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MULTILAYER CIRCUIT BOARD WITH RESIN BASES AND SEPARATORS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| PO BOX 747 |
| FALLS CHURCH, VA 22040 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME, CHUO-KU |
| OSAKA-SHI, OSAKA, JAPAN 541-0041 |
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| GLOBAL IP COUNSELORS, LLP |
| 1233 20TH STREET, NW, SUITE 700 |
| WASHINGTON, DC 20036-2680 |
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