Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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13610077
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Filing Dt:
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09/11/2012
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Publication #:
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Pub Dt:
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07/04/2013
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Inventors:
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Chul PARK, Sun-Won Kang, Kil-Soo Kim, Joong-Hyun Baek
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Title:
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INTEGRATED CIRCUIT PACKAGES HAVING REDISTRIBUTION STRUCTURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| MYERS BIGEL SIBLEY & SAJOVEC/KSC |
| PO BOX 37428 |
| RALEIGH, NC 27627 |
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