Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/29/2014
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Application #:
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13327059
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Filing Dt:
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12/15/2011
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Publication #:
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Pub Dt:
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04/12/2012
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Inventors:
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Taqing Feng, Zhijian Li, Yuping Hong, Hongliang Chen, Jian Shi
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Title:
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HEAT DISSIPATION DEVICE AND RADIO FREQUENCY MODULE WITH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| HUAWEI TECHNOLOGIES CO., LTD./FINNEGAN |
| 901 NEW YORK AVENUE |
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| WASHINGTON, DC 20001 |
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