Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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11723028
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Filing Dt:
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03/16/2007
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Publication #:
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Pub Dt:
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09/27/2007
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Inventors:
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Hideki Arai, Satoshi Inada, Yoshikazu Moriyama, Noriki Juumatsu
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Title:
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Semiconductor manufacturing equipment and heater structural connection
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2068-3, OOKA NUMAZU-SHI |
SHIZUOKA-KEN, JAPAN 410-8510 |
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MR. ERNEST F. CHAPMAN |
FINNEGAN, HENDERSON, FARABOW, ET AL |
901 NEW YORK AVENUE, NW |
WASHINGTON, DC 20001-4413 |
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Assignment:
2
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A CORRECTIVE ASSIGNMENT TO CORRECT THE FOURTH ASSIGNOR NAME ON REEL 019100 FRAME 0657
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2068-3, OOKA NUMAZU-SHI |
SHIZUOKA-KEN, 410-8510, JAPAN |
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RICHARD V. BURGUJIAN |
FINNEGAN, HENDERSON, FARABOW, GARRETT |
& DUNNER, L.L.P. |
901 NEW YORK AVENUE, NW |
WASHINGTON, D.C. 20001-4413 |
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