Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13896593
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Filing Dt:
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05/17/2013
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Publication #:
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Pub Dt:
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11/21/2013
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Inventors:
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Zhiwei Wang, Jianhong Mao, Lei Zhang, Deming Tang
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Title:
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METHOD FOR LOW TEMPERATURE WAFER BONDING AND BONDED STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3000 LONG DONG AVE, BUILDING #5, SUITE 501B |
ZHANGJIANG HIGH TECH PARK |
SHANGHAI, CHINA 201203 |
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HARNESS, DICKEY & PIERCE, P.L.C. |
5445 CORPORATE DRIVE |
SUITE 200 |
TROY, MI 48098 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SUITE 204, YUANHU BUILDING, NO. 60 GREAT WESTERN ROAD, HIGH TECH NEW INDUSTRIAL PARK, HIGH TECH AREA |
XI'AN, CHINA 710119 |
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MUNCY, GEISSLER, OLDS & LOWE, P.C. |
4000 LEGATO RD., STE 310 |
FAIRFAX, VA 22033 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.204, CIRCULAR ARC BUILDING, NO.60, WEST ROAD, NEW INDUSTRIAL PARK, HIGH-TECH ZONE |
XI'AN, CHINA 710119 |
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BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT |
NINGBO, CHINA 315800 |
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ANOVA LAW GROUP C/O SMIC |
21495 RIDGETOP CIRCLE |
SUITE 300 |
STERLING, VA 20166 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT |
NINGBO, CHINA 315800 |
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ANOVA LAW GROUP C/O SMIC |
21495 RIDGETOP CIRCLE |
SUITE 300 |
STERLING, VA 20166 |
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05/12/2024 05:22 AM
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