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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/12/2014
Application #:
13063631
Filing Dt:
05/31/2011
Publication #:
Pub Dt:
09/08/2011
Inventors:
Jeong Don Kwon, Seung Min Hong, Ju Ho Shin
Title:
MULTI LAYER CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
Assignment: 1
Reel/Frame:
026359/0198Recorded: 05/31/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/13/2011
Exec Dt:
05/13/2011
Exec Dt:
05/13/2011
Assignee:
DOOSAN TOWER 18F, 18-12, ULCHI-RO 6KA, CHUNG-GU,
SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 100-730
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET
22ND FLOOR
HARTFORD, CT 06103
Assignment: 2
Reel/Frame:
026578/0164Recorded: 07/12/2011Pages: 7
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S COUNTRY FROM DEMOCRATIC PEOPLE'S REPUBLIC OF KOREA TO REPUBLIC OF KOREA PREVIOUSLY RECORDED ON REEL 026359 FRAME 0198. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECTIVE ASSIGNMENT.
Assignors:
Exec Dt:
05/13/2011
Exec Dt:
05/13/2011
Exec Dt:
05/13/2011
Assignee:
DOOSAN TOWER 18F, 18-12, ULCHI-RO 6KA, CHUNG-GU
SEOUL, KOREA, REPUBLIC OF 100-730
Correspondent:
CANTOR COLBURN LLP
20 CHURCH STREET, 22 FLOOR
HARTFORD, CT 06103

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