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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/26/2014
Application #:
13238652
Filing Dt:
09/21/2011
Publication #:
Pub Dt:
03/29/2012
Inventors:
Jiahong WU, Shabani B. MOHAMMAD
Title:
METHOD OF ETCHING SURFACE LAYER PORTION OF SILICON WAFER AND METHOD OF ANALYZING METAL CONTAMINATION OF SILICON WAFER
Assignment: 1
Reel/Frame:
028269/0001Recorded: 05/25/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/2011
Exec Dt:
11/29/2011
Assignee:
2-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8634
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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