Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/26/2014
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Application #:
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14259166
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Filing Dt:
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04/23/2014
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Publication #:
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Pub Dt:
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08/21/2014
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Inventors:
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Chi-Chao LIU, Chih-Jui WANG, Long-Chi CHEN
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Title:
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SEMICONDUCTOR CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1127, HEPING RD., BADE CITY |
| TAOYUAN, TAIWAN 334 |
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| CKC & PARTNERS CO., LTD. |
| 12TH FLOOR, RUTTONJEE HOUSE 11 DUDDELL |
| STREET |
| HONG KONG, HONG KONG |
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