Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/26/2014
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Application #:
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13352424
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Filing Dt:
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01/18/2012
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Publication #:
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Pub Dt:
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07/12/2012
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Inventors:
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Chris Apanius, Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal
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Title:
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Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9921 BRECKSVILLE ROAD |
BUILDING R |
BRECKSVILLE, OHIO 44141 |
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PAUL M. REZNICK |
420 FT. DUQUESNE BLVD., SUITE 1200 |
ONE GATEWAY CENTER |
PITTSBURGH, PA 15222 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-8, HIGASHI-SHINAGAWA, 2-CHROME SHINAGAWA-KU |
TOKYO, JAPAN 140-0002 |
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THE WEBB LAW FIRM |
ONE GATEWAY CTR, 420 FT DUQUESNE BLVD |
SUITE 1200 |
PITTSBURGH, PA 15222 |
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