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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/26/2014
Application #:
13778912
Filing Dt:
02/27/2013
Publication #:
Pub Dt:
07/10/2014
Inventors:
Hsiang-Jen TSENG, Ting-Wei CHIANG, Wei-Yu CHEN, Ruei-Wun SUN, Hung-Jung TSENG et al
Title:
METHOD AND LAYOUT OF AN INTEGRATED CIRCUIT
Assignment: 1
Reel/Frame:
030095/0950Recorded: 03/27/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/01/2013
Exec Dt:
03/14/2013
Exec Dt:
03/14/2013
Exec Dt:
03/15/2013
Exec Dt:
03/15/2013
Exec Dt:
03/01/2013
Exec Dt:
03/15/2013
Assignee:
NO. 8, LI-HSIN RD. VI
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
LOWE HAUPTMAN HAM & BERNER, LLP
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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