Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/02/2014
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Application #:
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11965973
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Filing Dt:
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12/28/2007
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Publication #:
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Pub Dt:
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07/03/2008
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Inventors:
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Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii
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Title:
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BONDING METHOD AND BONDING MATERIAL USING METAL PARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS LLP |
| 1300 N. 17TH STREET, SUITE 1800 |
| ARLINGTON, VA 22209 |
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