Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/02/2014
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Application #:
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13459924
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Filing Dt:
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04/30/2012
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Publication #:
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Pub Dt:
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10/31/2013
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Inventors:
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Michael Renne Ty Tan, Georgios Panotopoulos, Paul Kessler Rosenberg et al
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Title:
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COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11445 COMPAQ CENTER DRIVE WEST |
| HOUSTON, TEXAS 77070 |
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| HEWLETT-PACKARD COMPANY |
| 3404 E. HARMONY ROAD MS 35 |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| FORT COLLINS, CO 80528 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11445 COMPAQ CENTER DRIVE WEST |
| HOUSTON, TEXAS 77070 |
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| HEWLETT PACKARD ENTERPRISE |
| 3404 E. HARMONY ROAD MS 79 |
| FORT COLLINS, CO 80528 |
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