Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/09/2014
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Application #:
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14085168
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Filing Dt:
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11/20/2013
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Inventors:
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Chieh-Yuan Chi, Wei-Yu Chen, Hung-Wen Liu, Yan-Heng Chen, Hsi-Chang Hsu
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| EDWARDS WILDMAN PALMER LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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