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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/23/2014
Application #:
13951772
Filing Dt:
07/26/2013
Inventors:
Yuping Gong, Yan Xun Xue, Liang Zhao
Title:
MANUFACTURING METHOD OF A SEMICONDUCTOR PACKAGE OF SMALL FOOTPRINT WITH A STACK OF LEAD FRAME DIE PADDLE SANDWICHED BETWEEN HIGH-SIDE AND LOW-SIDE MOSFET
Assignment: 1
Reel/Frame:
030883/0637Recorded: 07/26/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/24/2013
Exec Dt:
07/24/2013
Exec Dt:
07/24/2013
Assignee:
ZEPHYR HOUSE, 122 MARRY STREET, P.O. BOX 709
GRAND CAYMAN, CAYMAN ISLANDS KY1-1107
Correspondent:
CHEIN-HWA S. TSAO
6684 MT PAKRON DRIVE
SAN JOSE, CA 95120

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