Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13938537
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Filing Dt:
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07/10/2013
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Publication #:
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Pub Dt:
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01/16/2014
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Inventors:
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Wei-Sheng LEI, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar
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Title:
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LASER, PLASMA ETCH, AND BACKSIDE GRIND PROCESS FOR WAFER DICING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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VANESSA L. YAZICIGIL |
1279 OAKMEAD PARKWAY |
SUNNYVALE, CA 94085-4040 |
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