Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/07/2014
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Application #:
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13730833
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Filing Dt:
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12/29/2012
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Publication #:
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Pub Dt:
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02/27/2014
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Inventors:
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AILEEN LI, JINGHUA NI
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Title:
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THROUGH SILICON VIA PACKAGING STRUCTURES AND FABRICATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 ZHANGJIANG ROAD, PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| ANOVA LAW GROUP C/O SMIC |
| 21351 GENTRY DRIVE |
| SUITE 150 |
| STERLING, VA 20166 |
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