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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/14/2014
Application #:
13281499
Filing Dt:
10/26/2011
Publication #:
Pub Dt:
01/10/2013
Inventors:
Tzyy-Jang Tseng, Chung-W. Ho
Title:
CORELESS PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF
Assignment: 1
Reel/Frame:
027121/0377Recorded: 10/26/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/20/2011
Exec Dt:
07/20/2011
Assignee:
NO. 38, HSING PONG ROAD, KWEI SAN INDUSTRIAL ZONE
TAOYUAN, TAIWAN
Correspondent:
EDWARDS WILDMAN PALMER LLP
P.O. BOX 55874
BOSTON, MA 02205

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