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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/28/2014
Application #:
13170494
Filing Dt:
06/28/2011
Publication #:
Pub Dt:
01/03/2013
Inventors:
Jian LIU, Jiayuan FANG
Title:
METHODS, SYSTEMS, AND COMPUTER-READABLE MEDIA FOR SIMULATING INTERCONNECTS IN ELECTRONIC PACKAGING STRUCTURES
Assignment: 1
Reel/Frame:
026515/0710Recorded: 06/28/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/24/2011
Exec Dt:
06/24/2011
Assignee:
900 E. HAMILTON AVENUE
SUITE 500
CAMPBELL, CALIFORNIA 95008
Correspondent:
GANG YE
11955 FREEDOM DRIVE
FINNEGAN
RESTON, VA 20190-5675

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