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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8877623
Issue Dt:
11/04/2014
Application #:
13471128
Filing Dt:
05/14/2012
Publication #:
20130302976
Pub Dt:
11/14/2013
Inventors:
Ssu-I Fu, Chih-Wei Chen, Wen-Tai Chiang, Shih-Hung Tsai, Ying-Tsung Chen, Chien-Ting Lin
Title:
METHOD OF FORMING SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
028205/0132Recorded: 05/14/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
TSAI, SHIH-HUNG
Exec Dt:
05/08/2012
Assignee:
UNITED MICROELECTRONICS CORP.
NO. 3, LI-SHIN RD. II, SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN
Correspondent:
J C PATENTS
4 VENTURE, SUITE 250
IRVINE, CA 92618
Assignment: 2
Reel/Frame:
029059/0251Recorded: 09/24/2012Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO ADD INVENTORS' NAME ON AN ASSIGNMENT PREVIOUSLY RECORDED ON REAL 028205 AND FRAME 0132.
Assignors:
TSAI, SHIH-HUNG
Exec Dt:
05/08/2012
FU, SSU-I
Exec Dt:
05/08/2012
CHEN, YING-TSUNG
Exec Dt:
05/08/2012
CHEN, CHIH-WEI
Exec Dt:
05/08/2012
LIN, CHIEN-TING
Exec Dt:
05/08/2012
CHIANG, WEN-TAI
Exec Dt:
05/08/2012
Assignee:
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
J. C. PATENTS
4, VENTURE SUITE 250
IRVINE, CA 92618

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