Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/11/2014
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Application #:
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13644888
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Filing Dt:
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10/04/2012
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Publication #:
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Pub Dt:
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04/25/2013
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Inventor:
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Yuji Inatani
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Title:
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METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD, AND MULTI-LAYER CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-5-1, KIBA, KOTO-KU |
| TOKYO, JAPAN 135-8512 |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
| 1250 CONNECTICUT AVE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-5-1, KIBA, KOTO-KU |
| TOKYO, JAPAN 135-8512 |
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| WHDA |
| 8500 LEESBURG PIKE, SUITE 7500 |
| TYSONS CORNER, VA 22182 |
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