Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/11/2014
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Application #:
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14143178
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Filing Dt:
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12/30/2013
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Publication #:
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Pub Dt:
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04/24/2014
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Inventors:
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Un-Byoung KANG, Yong-Hoon KIM, Jong-Joo LEE, Tae-Hong MIN
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Title:
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MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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| STANZIONE & KIM, LLP |
| 919 18TH STREET, NW |
| SUITE 440 |
| WASHINGTON, DC 20006 |
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