Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/18/2014
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Application #:
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13614879
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Filing Dt:
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09/13/2012
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Publication #:
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Pub Dt:
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03/13/2014
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Inventors:
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Xuejin Wen, Peter J. Nystrom, Gary D. Redding, Jun Ma
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Title:
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HIGH DENSITY THREE-DIMENSIONAL ELECTRICAL INTERCONNECTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100 INVERNESS TERRACE EAST |
| ENGLEWOOD, COLORADO 80112 |
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| KILPATRICK TOWNSEND & STOCKTON LLP |
| 1400 WEWATTA STREET |
| SUITE 600 |
| DENVER, CO 80202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 45 GLOVER AVENUE |
| P.O. BOX 4505 |
| NORWALK, CONNECTICUT 06856 |
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| MH2 TECHNOLOGY LAW GROUP, LLP (CUST. NO. |
| 1951 KIDWELL DRIVE |
| SUITE 550 |
| TYSONS CORNER, VA 22182 |
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