Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/25/2014
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Application #:
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13261584
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Filing Dt:
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02/05/2013
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Publication #:
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Pub Dt:
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05/30/2013
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Inventors:
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Yoshitsugu Sakamoto, Hiroyuki Yamada, Tsukasa Ohnishi, Shunsaku Yoshikawa et al
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Title:
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Bonding Material for Semiconductor Devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| MICHAEL TOBIAS |
| 1629 K STREET NW |
| SUITE 300 |
| WASHINGTON, DC 20006 |
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