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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/02/2014
Application #:
12277863
Filing Dt:
11/25/2008
Publication #:
Pub Dt:
06/04/2009
Inventors:
Osamu OHASHI, Keiichi Minegishi, Yasunori Yoshida, Kouji Wada
Title:
BONDING METHOD AND APPARATUS THEREFOR
Assignment: 1
Reel/Frame:
021899/0404Recorded: 11/28/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/01/2008
Exec Dt:
11/07/2008
Exec Dt:
11/07/2008
Exec Dt:
11/07/2008
Assignee:
AKIHABARA UDX 15F, 4-14-1, SOTOKANDA, CHIYODA-KU
TOKYO, JAPAN 101-0021
Correspondent:
RONALD TURNER
OBLON, SPIVAK, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314

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