Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/02/2014
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Application #:
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12758702
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Filing Dt:
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04/12/2010
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Publication #:
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Pub Dt:
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10/13/2011
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Inventors:
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Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
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Title:
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SURFACE MOUNT DEVICE THIN PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6F, PHOTONICS CENTRE, NO. 2 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK |
| HONG KONG, CHINA |
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| JAYE G. HEYBL |
| KOPPEL, PATRICK, HEYBL & DAWSON |
| 2815 TOWNSGATE ROAD, SUITE 215 |
| WESTLAKE VILLAGE, CA 91361 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TCL INDUSTRIAL AREA, NO. 21 JIANGBEI YUNSHAN EAST RD. |
| HUIZHOU MUNICIPALITY, GUANGDONG PROVINCE, CHINA |
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| KOPPEL PATRICK HEYBL & DAWSON |
| 2815 TOWNSGATE ROAD |
| SUITE 215 |
| WESTLAKE VILLAGE, CA 91361 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 38 HECHANG LIU ROAD EAST |
| ZHONGKAI HIGH-TECH INDUSTRIAL DEVELOPMENT PARK |
| HUIZHOU CITY, GUANGDONG, CHINA 516006 |
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| WITHROW + TERRANOVA, PLLC |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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