Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13853982
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Filing Dt:
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03/29/2013
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Publication #:
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Pub Dt:
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10/02/2014
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Inventors:
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Hongjin Jiang, Arun Kumar C. Nallani, Rajen S. Sidhu, Martha A. Dudek, Weihua Tang
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Title:
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HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY SOKOLOFF TAYLOR ZAFMAN LLC |
| 1279 OAKMEAD PARKWAY |
| SUNNYVALE, CA 94085-4040 |
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