Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13816644
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Filing Dt:
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02/12/2013
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Publication #:
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Pub Dt:
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06/06/2013
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Inventors:
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Kenji Miyata, Toshitaka Yamagata
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Title:
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RESIN COMPOSITION, MOLDED OBJECT AND SUBSTRATE MATERIAL BOTH OBTAINED FROM THE RESIN COMPOSITION, AND CIRCUIT BOARD INCLUDING THE SUBSTRATE MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1 NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 1038338 |
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| ROBERTS MLOTKOWSKI SAFRAN & COLE, P.C. |
| P.O. BOX 10064 |
| MCLEAN, VA 22102-8064 |
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