Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13851738
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Filing Dt:
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03/27/2013
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Publication #:
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Pub Dt:
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10/02/2014
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Inventors:
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Ercan Mehmet Dede, Shuhei Horimoto, Tsuyoshi Nomura
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Title:
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POWER ELECTRONICS MODULES WITH SOLDER LAYERS HAVING REDUCED THERMAL STRESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 25 ATLANTIC AVENUE |
| ERLANGER, KENTUCKY 41018 |
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| DINSMORE & SHOHL LLP |
| 255 EAST FIFTH STREET |
| SUITE 1900 |
| CINCINNATI, OH 45202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 TOYOTA-CHO |
| TOYOTA-SHI |
| AICHI-KEN, JAPAN 471-8571 |
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| DINSMORE & SHOHL LLP |
| 255 E. FIFTH STREET |
| SUITE 1900 |
| CINCINNATI, OH 45202 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF, JAPAN 448-8661 |
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| DINSMORE & SHOHL LLP |
| 900 WILSHIRE DRIVE, SUITE 300 |
| TROY, MI 48084 |
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