Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/30/2014
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Application #:
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13053440
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Filing Dt:
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03/22/2011
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Publication #:
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Pub Dt:
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09/01/2011
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Inventor:
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Fan Wang
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Title:
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METHOD AND APPARATUS FOR BINDING REDUNDANCY VERSIONS WITH A SYSTEM FRAME NUMBER AND SUBFRAME NUMBERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 N. STETSON AVENUE |
| CHICAGO, IL 60601-6731 |
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