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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/06/2015
Application #:
13478138
Filing Dt:
05/23/2012
Publication #:
Pub Dt:
11/29/2012
Inventors:
Seung HAN, Ju Mi KIM, Sung Su PARK, Eun Jung LEE
Title:
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME
Assignment: 1
Reel/Frame:
028253/0021Recorded: 05/23/2012Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/21/2012
Exec Dt:
05/21/2012
Exec Dt:
05/21/2012
Exec Dt:
05/21/2012
Assignee:
290 GONGDAN-DONG
GUMI-SI, KYEONGSANGBUK-DO, KOREA, REPUBLIC OF 730-030
Correspondent:
EUGENE M. LEE
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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