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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
01/06/2015
Application #:
13044871
Filing Dt:
03/10/2011
Publication #:
Pub Dt:
09/22/2011
Inventors:
Shigeru ASAMI, Seiichi TAJIMA, Hiroki HARA, Shuichi TAKIZAWA, Masumi KAMEDA et al
Title:
ELECTRONIC CIRCUIT MODULE COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC CIRCUIT MODULE COMPONENT
Assignment: 1
Reel/Frame:
025982/0056Recorded: 03/10/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/04/2011
Exec Dt:
03/04/2011
Exec Dt:
03/04/2011
Exec Dt:
03/04/2011
Exec Dt:
03/04/2011
Exec Dt:
03/04/2011
Assignee:
1-13-1, NIHONBASHI, CHUO-KU
TOKYO 103-8272, JAPAN
Correspondent:
JAMES A. OLIFF
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA, VIRGINIA 22320-4850
Assignment: 2
Reel/Frame:
030651/0687Recorded: 06/12/2013Pages: 11
Conveyance:
CHANGE OF ADDRESS
Assignor:
Exec Dt:
06/12/2013
Assignee:
3-9-1, SHIBAURA, MINATO-KU
TOKYO 108-0023, JAPAN
Correspondent:
JAMES A. OLIFF
OLIFF & BERRIDGE, PLC
P.O. BOX 19928
ALEXANDRIA, VA 22320

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