Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/13/2015
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Application #:
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13136826
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Filing Dt:
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08/11/2011
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Publication #:
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Pub Dt:
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03/29/2012
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Inventors:
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Keiji Shinyama, Tomoya Uchida
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Title:
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PLATING APPARATUS AND PLATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| H. KEITH MILLER, ESQ. |
| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE OMISSION OF THE SECOND CONVEYOR PREVIOUSLY RECORDED ON REEL 026797 FRAME 0194. ASSIGNOR(S) HEREBY CONFIRMS THE CONVEYORS ARE KEIJI SHINYAMA AND TOMOYA UCHIDA.
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| HARNESS, DICKEY & PIERCE, PLC |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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