Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/17/2015
|
Application #:
|
13800626
|
Filing Dt:
|
03/13/2013
|
|
Publication #:
|
|
Pub Dt:
|
08/01/2013
| | | | |
|
Inventors:
|
Mill-Jer WANG, Hao CHEN, Hung-Chih LIN, Ching-Nen PENG
|
|
Title:
|
METHOD OF TESTING THROUGH SILICON VIAS (TSVS) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC)
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
|
|
|
|
| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
|
|
Search Results as of:
05/07/2024 09:11 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
