Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/03/2015
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Application #:
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13483247
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Filing Dt:
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05/30/2012
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Publication #:
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Pub Dt:
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08/22/2013
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Inventors:
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Yuen-Han Wang, Sheng-Li Lu, Jih-Fu Wang, Hsien-Wen Chen, Kuan-Yu Yang
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Title:
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SEMICONDUCTOR PACKAGE HAVING LIGHT-EMITTING-DIODE SOLDER-BONDED ON FIRST AND SECOND CONDUCTIVE PADS SEPARATED BY AT LEAST 75 UM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| EDWARDS WILDMAN PALMER LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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