Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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12866883
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Filing Dt:
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01/10/2011
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Publication #:
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Pub Dt:
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09/08/2011
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Inventors:
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Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta
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Title:
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HEAT SINK, COOLING MODULE AND COOLABLE ELECTRONIC BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11620-45 KIIRE |
| HITOKURA, JAPAN 891-0204 |
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| 1-21-40 KORIMOTO |
| KAGOSHIMA, JAPAN 890-0065 |
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| TIMOTHY M. MORELLA |
| 2222 WELLINGTON COURT |
| LISLE, IL 60532 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11620-45 KIIRE, HITOKURA-CHO |
| KAGOSHIMA, JAPAN 891-0204 |
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| MOLEX INCORPORATED |
| 2222 WELLINGTON COURT |
| LISLE, IL 60532 |
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